Low-Stress Silicon Nitride Platform for Broadband Mid-Infrared Microphotonics Conference Paper uri icon


  • © 2014 IEEE. We experimentally demonstrate a sophisticated mid-IR microphotonics platform adopting engineered Si-rich and low-stress silicon nitride (SiNx) thin films where an extensive infrared transparency up to λ = 8.5 μm is achieved. Furthermore, because of the designed low-stress property, the SiNx deposition is able to reach a thickness > 2 μm that significantly reduces mid-IR waveguide loss to less than 0.2 dB/cm. We show directional couplers functioning over a broad infrared spectrum, thus enabling monolithic mid-IR multiplexing schemes for integrated linear and nonlinear photonics leading to sophisticated label-free sensing technologies.

author list (cited authors)

  • Lin, P. T., Singh, V., Lin, H., Tiwald, T., Kimerling, L. C., Tan, D., & Agarwal, A. M.

citation count

  • 0

publication date

  • November 2014