Low-Stress Silicon Nitride Platform for Broadband Mid-Infrared Microphotonics
Additional Document Info
2014 IEEE. We experimentally demonstrate a sophisticated mid-IR microphotonics platform adopting engineered Si-rich and low-stress silicon nitride (SiNx) thin films where an extensive infrared transparency up to = 8.5 m is achieved. Furthermore, because of the designed low-stress property, the SiNx deposition is able to reach a thickness > 2 m that significantly reduces mid-IR waveguide loss to less than 0.2 dB/cm. We show directional couplers functioning over a broad infrared spectrum, thus enabling monolithic mid-IR multiplexing schemes for integrated linear and nonlinear photonics leading to sophisticated label-free sensing technologies.
name of conference
2014 IEEE Avionics, Fiber-Optics and Photonics Technology Conference (AVFOP)