PROPERTIES OF JOINTS IN COMPOSITE SPECIMENS OF ALUMINUM AND COPPER. Academic Article uri icon

abstract

  • Results of shear stress, electrical resistance and thermal resistance measurements on joints in Al-Al and Cu-Cu composite conductors are reported. Specimens are formed by soldering and co-drawing together tube and rod components. Shear stress measurements indicate pressure joints are more resistant to slippage than solder joints in the Al-Al composites. The bond in Cu-Cu composites is strongest for specimens joined by soldering plus coreduction. The thermal resistance of a joint formed by coreduction is found to decrease rapidly as the amount of deformation increases, while the electrical resistance shows no trend. This trend is not as dramatic in soldered joints. These conductors are intended for use in superconducting magnets.

author list (cited authors)

  • Hartwig, K. T., & Van Sciver, S. W.

publication date

  • January 1979