Tantalum sheet for superconductor diffusion barrier applications
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abstract
This report presents preliminary results of a project with the aim to fabricate fine-grained tantalum sheet having a uniform microstructure that co-deforms well with pure copper for superconductor diffusion barrier applications. Multi-pass equal channel angular extrusion (ECAE) was used to refine the microstructure of 25 mm square cross-section bars of Ta; rolling was used to convert the bars to 0.38 mm thick sheet. Cu-Ta co-deformation characteristics were evaluated by assembling and drawing experimental Cu-Ta composite wires, containing the ECAE processed sheets, to 0.83 mm diameter and metallographically examining the thinned 2-4 micron Ta layer. The ECAE processed Ta sheet co-deformed well with Cu, and was found to have a smaller recrystallized grain size, a narrower grain size distribution and a slightly higher hardness compared to commercial diffusion barrier grade Ta sheet. The favorable results encourage further work. 2006 American Institute of Physics.
