Tantalum Sheet for Superconductor Diffusion Barrier Applications Conference Paper uri icon

abstract

  • This report presents preliminary results of a project with the aim to fabricate fine-grained tantalum sheet having a uniform microstructure that co-deforms well with pure copper for superconductor diffusion barrier applications. Multi-pass equal channel angular extrusion (ECAE) was used to refine the microstructure of 25 mm square cross-section bars of Ta; rolling was used to convert the bars to 0.38 mm thick sheet. Cu-Ta co-deformation characteristics were evaluated by assembling and drawing experimental Cu-Ta composite wires, containing the ECAE processed sheets, to 0.83 mm diameter and metallographically examining the thinned 2-4 micron Ta layer. The ECAE processed Ta sheet co-deformed well with Cu, and was found to have a smaller recrystallized grain size, a narrower grain size distribution and a slightly higher hardness compared to commercial diffusion barrier grade Ta sheet. The favorable results encourage further work. © 2006 American Institute of Physics.

author list (cited authors)

  • Mathaudhu, S. N., Hartwig, K. T., Barber, R. E., & Pyon, T.

publication date

  • January 1, 2006 11:11 AM

publisher

  • AIP  Publisher