Hardness, electrical resistivity, and modeling of in situ Cu–Nb microcomposites
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This paper reports our investigation on the evolution of microstructure, hardness, and electrical conductivity of in situ Cu-16.5 vol.%Nb microcomposites as a function of drawing strain. Both interface area density and lattice distortion were taken into account for analyzing the hardness and resistivity at different levels of plastic strain. A model was developed for describing microstructure dimensions including both spacing and curl of Nb ribbons. Based on this model, a modified Hall-Petch formula was derived. Our results suggest that interface area density and lattice distortion have significant impacts on both hardness and electrical resistivity. © 2014 Elsevier B.V. All rights reserved.
author list (cited authors)
Deng, L., Han, K. e., Hartwig, K. T., Siegrist, T. M., Dong, L., Sun, Z., Yang, X., & Liu, Q.