Stable crack growth during actuation in shape memory alloys Conference Paper uri icon


  • A finite element analysis of crack growth is carried out in an in nite center-cracked shape memory alloy plate subjected to thermal variations under plane strain mode I constant applied loading. Crack is assumed to propagate when the energy release rate reaches a material specific critical value. The virtual crack growth technique is employed to calculate the energy release rate, which was shown to increase an order of magnitude at constant applied loading as a result of phase transformation induced by thermal variations.1 A fracture toughening is observed associated with the energy dissipated by the transformed material in the wake of the growing crack and its sensitivity over key thermomechanical parameters is presented. 2014 SPIE.

name of conference

  • SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring

published proceedings

  • SPIE Proceedings

author list (cited authors)

  • Jape, S., Baxevanis, T., & Lagoudas, D. C.

editor list (cited editors)

  • Goulbourne, N. C., & Naguib, H. E.

publication date

  • January 1, 2014 11:11 AM