Plasticity in polycrystalline thin films: A 2D dislocation dynamics approach Conference Paper

abstract

• Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film-substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

authors

• Needleman, Alan

published proceedings

• MULTISCALE PHENOMENA IN MATERIALS-EXPERIMENTS AND MODELING RELATED TO MECHANICAL BEHAVIOR

author list (cited authors)

• Nicola, L., Van der Giessen, E., & Needleman, A.

complete list of authors

• Nicola, L||Van der Giessen, E||Needleman, A

publication date

• December 2003

published in

• MRS Online Proceedings Library  Journal

International Standard Book Number (ISBN) 10

• 1-55899-716-4

start page

• 159

end page

• 163

volume

• 779