Plasticity in polycrystalline thin films: A 2D dislocation dynamics approach Conference Paper uri icon

abstract

  • Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film-substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

published proceedings

  • MULTISCALE PHENOMENA IN MATERIALS-EXPERIMENTS AND MODELING RELATED TO MECHANICAL BEHAVIOR

author list (cited authors)

  • Nicola, L., Van der Giessen, E., & Needleman, A

complete list of authors

  • Nicola, L||Van der Giessen, E||Needleman, A

publication date

  • December 2003