AN ANALYSIS OF SHEAR BAND DEVELOPMENT INCORPORATING HEAT-CONDUCTION Academic Article uri icon

abstract

  • We incorporate the effects of material temperature sensitivity and heat conduction into an infinite band type analysis of shear localization. Full account is taken of finite geometry changes, but inertial effects are neglected. An energy balance is written between homogeneously deforming bands in a manner that models conditions in our recent finite element study of shear band development from internal inhomogeneities in a solid subject to plane strain compression. The band analysis requires specification of an imperfection amplitude and a length scale over which heat conduction effects are significant. These are chosen to match results of a finite element analysis. The predictions of the simple band analysis and the results of full finite element calculations are then compared for a wide range of material properties for both isotropic and kinematic hardening characerizations of the flow potential surface. The predicted dependence of the onset of locatization on material properties such as strain hardening and strain rate sensitivity is the same for both types of analysis. 1987.

published proceedings

  • MECHANICS OF MATERIALS

author list (cited authors)

  • LEMONDS, J., & NEEDLEMAN, A.

citation count

  • 31

complete list of authors

  • LEMONDS, J||NEEDLEMAN, A

publication date

  • January 1986