Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint Formation Academic Article

abstract

• In this work, we compare the microstructural evolution of Sn/Cu/Sn and Cu/Sn/Cu 'sandwich' configurations under metallurgical bonding conditions. These simulations are relevant in explaining experimental observations that suggest that the resulting dominant intermetallic compound in Cu-Sn systems depends on the relative supply of Cu and Sn. Through the analysis of morphological evolution and growth rate, it is shown that the Cu6Sn5 layer becomes dominant in the Sn/Cu/Sn structure, while the Cu/Sn/Cu structure is dominated by Cu3Sn after extended reaction periods. 2014 TMS.

authors

• Arroyave, Raymundo

published proceedings

• JOURNAL OF ELECTRONIC MATERIALS

author list (cited authors)

• Park, M. S., Gibbons, S. L., & Arroyave, R.

citation count

• 3

complete list of authors

• Park, MS||Gibbons, SL||Arroyave, R

publication date

• July 2014

publisher

• Springer Nature  Publisher

keywords

• Cu-Sn System
• Multiphase-field Model
• Sn/Cu/Sn Structures
• TLP Bonding

Digital Object Identifier (DOI)

• 10.1007/s11664-014-3151-0

start page

• 2510

end page

• 2520

volume

• 43

issue

• 7

URL

• http%3A%2F%2Fdx.doi.org%2F10.1007%2Fs11664-014-3151-0