publication venue for
- Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat. 145. 2023
- A System to Package Perspective on Transient Thermal Management of Electronics. 142. 2020
- On failure mechanisms in flip chip assembly - Part 1: Short-time scale wave motion. 130:021008-02100811. 2008
- Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources. 117:52-62. 1995
- On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices. 114:436-442. 1992
- Nonlinear dynamic response of a printed circuit board to shock loads applied to its support contour