publication venue for
- A System to Package Perspective on Transient Thermal Management of Electronics. 142. 2020
- On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion. 130:021008-02100811. 2008
- On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials. 130:021009-0210098. 2008
- Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources. 117:52-62. 1995
- On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices. 114:436-442. 1992